Towards an inductively coupled power/data link for bondpad-less silicon chips (2011)
Attributed to:
A bidirectional power/data transfer platform based on electro-optical effects in standard CMOS
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/iscas.2011.5938136
Publication URI: http://dx.doi.org/10.1109/iscas.2011.5938136
Type: Conference/Paper/Proceeding/Abstract
ISBN: 978-1-4244-9473-6