Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules (2013)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/TDMR.2012.2235836

Publication URI: http://dx.doi.org/10.1109/TDMR.2012.2235836

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Device and Materials Reliability

Issue: 1