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Design, Fabrication, and Characterization of Flip-Chip Bonded Microinductors (2009)

First Author: Flynn D

Attributed to: Scottish Manufacturing Institute - Renewal, 2008 - 2013 funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tmag.2009.2016558

Publication URI: http://dx.doi.org/10.1109/tmag.2009.2016558

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Magnetics

Issue: 8