Design, Fabrication, and Characterization of Flip-Chip Bonded Microinductors (2009)
Attributed to:
Scottish Manufacturing Institute - Renewal, 2008 - 2013
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tmag.2009.2016558
Publication URI: http://dx.doi.org/10.1109/tmag.2009.2016558
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Magnetics
Issue: 8