Effect of deposition conditions and post deposition anneal on reactively sputtered titanium nitride thin films (2015)
Attributed to:
Ferroelectrics for Nanoelectronics (FERN)
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.tsf.2015.02.009
Publication URI: http://dx.doi.org/10.1016/j.tsf.2015.02.009
Type: Journal Article/Review
Parent Publication: Thin Solid Films