Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires (2013)
Attributed to:
An Innovative Electronics Manufacturing Research Centre
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s11664-012-2385-y
Publication URI: http://dx.doi.org/10.1007/s11664-012-2385-y
Type: Journal Article/Review
Parent Publication: Journal of Electronic Materials
Issue: 3