Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires (2013)

First Author: Agyakwa P
Attributed to:  An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11664-012-2385-y

Publication URI: http://dx.doi.org/10.1007/s11664-012-2385-y

Type: Journal Article/Review

Parent Publication: Journal of Electronic Materials

Issue: 3