Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process (2011)
Attributed to:
An Innovative Electronics Manufacturing Research Centre
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.actamat.2010.10.053
Publication URI: http://dx.doi.org/10.1016/j.actamat.2010.10.053
Type: Journal Article/Review
Parent Publication: Acta Materialia
Issue: 3