Durable High Temperature Electronics Packaging for Down-Well Applications
Lead Participant:
GE Aviation Systems Limited
Abstract
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Lead Participant | Project Cost | Grant Offer |
|---|---|---|
Participant |
||
| GE Aviation Systems Limited, Cheltenham, United Kingdom | ||
| University of Oxford, United Kingdom | £104,830 | |
| Sondex Wireline Limited, FARNBOROUGH | £50,208 | £ 19,722 |
| Vibro-meter U.K. Limited, Basingstoke, United Kingdom | £67,252 | £ 26,423 |
| Thermastrate Ltd., GATESHEAD | £54,919 | £ 21,572 |
| Gwent Electronic Materials Limited, PONTYPOOL | £111,493 | £ 43,794 |
People |
ORCID iD |