ELCOSINT – Electronic Component Sintered Interconnections

Abstract

The ELCOSINT project will develop novel polymeric, sintered interconnection materials for electronic assemblies specifically designed to replace high-Pb content materials and further increase the operating temperature of electronic assemblies. The UK has a significant high value manufacturing base in demanding harsh environment applications such as aerospace, down hole drilling, automotive and power management. The multi-disciplinary project team will develop the materials and manufacturing process for electronic component interconnection using nano-silver based materials to form joints between components and substrates. The technology will be compatable with standard microelectronics manufacturing process enabling fast take up. A high temperature sensor amplifier demonstrator will be designed and produced that will allow the characterisation, assessment and qualification of the developments to enable rapid production of reliable, robust electronic systems.

Lead Participant

Project Cost

Grant Offer

Microchip Technology Caldicot Limited, Bristol £313,049 £ 155,024
 

Participant

Gwent Electronic Materials Limited, PONTYPOOL £319,999 £ 160,000
Npl Management Limited, TEDDINGTON £308,974 £ 154,487

Publications

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