Tamessa - Turning up the heat in electronics
Lead Participant:
MICROCHIP TECHNOLOGY CALDICOT LIMITED
Abstract
The Tamessa project represents a step change in harsh environment electronic assembly. Tamessa will develop a integrated system will eliminate the need to use expensive & heavy ceramic technologies in applications up to 225Deg C and allow the integration of bespoke through hole components. Typical applications benefiting from this system are aerospace, automotive, offshore & power management or other areas were electronics are subjected to high temperature, salt and hydrocarbons. OEMs will benefit from 30% reduction in board cost, 50% reduction in board weight and 95% reduction in tooling NRE cost. Energy cost associated with manufacture are signifcantly reduced.
Lead Participant | Project Cost | Grant Offer |
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MICROCHIP TECHNOLOGY CALDICOT LIMITED | £161,867 | £ 80,934 |
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Participant |
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GWENT ELECTRONIC MATERIALS LIMITED | £157,662 | £ 94,597 |
NPL MANAGEMENT LIMITED | £174,901 | £ 87,451 |
INNOVATE UK |
People |
ORCID iD |
Tracy Wotherspoon (Project Manager) |