Silicon Carbide Interconnect Optimisation Project
Lead Participant:
DZP TECHNOLOGIES LIMITED
Abstract
The Silicon Carbide Interconnect Optimisation Project (SCIOP) aims to develop a novel form of die interconnect for the power electronics sector. The project objectives are to explore alternative materials, processes and adhesion technologies which can contribute to improved power module performance and simplified production processes. Improved performance and reduced cost in the enabling technologies of power electronics, due to the pervasive nature of the technology (electric motors, power grids, etc.), has the potential to make a significant contribution in helping the UK exploit semiconductor innovation and in a broader context help move to a low-carbon economy.
Lead Participant | Project Cost | Grant Offer |
---|---|---|
DZP TECHNOLOGIES LIMITED | £155,109 | £ 108,576 |
  | ||
Participant |
||
ANVIL SEMICONDUCTORS LIMITED | £88,065 | £ 61,646 |
INNOVATE UK |
People |
ORCID iD |
Zlatka Stoeva (Project Manager) |