Package for NIR LFA CMT Sensors

Lead Participant: E2v Technologies Plc


This project will develop innovative large format array packaging technology for near infra-red imaging sensors. This project will support sensor arrays for the next generation of large telescopes and it will be a crucial enabler of the sensor technology that will investigate events early in the evolution of the universe.

Lead Participant

Project Cost

Grant Offer

E2v Technologies Plc, ESSEX £97,319 £ 47,998


Leonardo MW Ltd £60,699 £ 30,350


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