Materials Characterisation for Embedded Electronics

Embedded electronics is an emerging technology where bare silicon dies are embedded into layered printed circuit board (PCB) structures (see figure) enabling a wide range of applications. The embedding of die into PCBs both reduces overall device size and increases processing speeds.
Testing of the materials makes use of embedded systems and the electronic interconnects (e.g. solder joints, wire-bonding) within a layered structure and is inherently problematic due to effects of different interfaces and uncertainty surrounding potential parasitic effects. Additionally there is little understood about the role of moisture ingress, effects of protective coatings and degradation due to oxygen ingress.
We are looking for a student to evaluate a range of test methods and develop a suitable testing regime which is compatible with standard manufacturing methods. The work will involve:
relating electrical test data to direct inspection data (obtained by nano & micro characterisation techniques) to develop a deep understanding of the effect of various nanoscale degradation mechanism that could occur in such embedded systems.
Evaluating, refining and defining test protocols and methodologies to enable reliable and robust diagnostic measurements to be made routinely.