C-band quantum-dot lasers on monolithically grown Si platform
Lead Research Organisation:
CARDIFF UNIVERSITY
Department Name: School of Physics and Astronomy
Abstract
We are living in an increasingly digitalised world where data has become critical to all aspects of human life. Today's data centres are consuming about 3 percent of the global electricity supply and this number is likely to triple in the next decade. Remarkably, more than 50% of the power consumption in high-performance computing and data centres is associated with moving information around, rather than processing it. The current COVID-19 pandemic highlights the importance of healthcare monitoring and remote working using high speed broadband connections. Optical communications is essential to accommodate the need for high speed and bandwidth, while at the same time reducing the power required. In the meantime, 3D imaging and sensing is pushing the next revolution in consumer electronics by facilitating artificial intelligence (AI)-powered devices. LiDAR, or Light Detection and Ranging, is one of the key technologies enabling this market growth with anticipated market share reaching $6 billion by 2024, 70% of which dedicated to automotive applications.
From telecommunications to sensing applications, photons have proven to be the most efficient platform. As optical communication is penetrating to shorter and shorter distances and the 3D imaging and sensing expanding across the consumer, automotive, medical and industry/commercial sectors, the photonics manufacturing industry is on the verge of technological advancements. However, high cost, low volume capacity and limited scalability of the photon-based platform has become the bottleneck hindering cutting-edge technologies entering mass production. In this regard, integrating bulky, expensive optical components (the lasers, modulators, amplifiers, detectors and lenses) onto a much affordable and scalable platform like silicon is being much sought after by major industry and academic groups. Over the last six decades, silicon has driven the production of new technologies based on electrons at ever astounding volumes. Looking ahead, the silicon platform can be leveraged as a means to overcome the scalability, manufacturing and system architecture challenges experienced by photonics industry, impacting a range of emerging markets where small form factor, low-cost manufacturing and power efficiency are figures of merit.
In this project, we aim to integrate high-performance lasers and amplifiers operating at the strategically important C-band at 1550 nm onto the scalable silicon platform. These devices are one of the most critical components enabling long-haul optical fibre communications, inter-data centre optical interconnect and emerging 3D imaging and sensing technologies including eye-safe LiDAR chips. Leveraging the complementary growth techniques of molecular beam epitaxy (MBE) and metal organic chemical vapour deposition (MOCVD), we will incorporate manufacturable nanostructures as the gain medium to realise advanced devices surpassing state-of-the-art. Several routes will be explored to overcome the challenges in growing these materials and devices onto silicon towards fully integrated photonic platforms, opening up the opportunity for low cost and high volume mass production.
From telecommunications to sensing applications, photons have proven to be the most efficient platform. As optical communication is penetrating to shorter and shorter distances and the 3D imaging and sensing expanding across the consumer, automotive, medical and industry/commercial sectors, the photonics manufacturing industry is on the verge of technological advancements. However, high cost, low volume capacity and limited scalability of the photon-based platform has become the bottleneck hindering cutting-edge technologies entering mass production. In this regard, integrating bulky, expensive optical components (the lasers, modulators, amplifiers, detectors and lenses) onto a much affordable and scalable platform like silicon is being much sought after by major industry and academic groups. Over the last six decades, silicon has driven the production of new technologies based on electrons at ever astounding volumes. Looking ahead, the silicon platform can be leveraged as a means to overcome the scalability, manufacturing and system architecture challenges experienced by photonics industry, impacting a range of emerging markets where small form factor, low-cost manufacturing and power efficiency are figures of merit.
In this project, we aim to integrate high-performance lasers and amplifiers operating at the strategically important C-band at 1550 nm onto the scalable silicon platform. These devices are one of the most critical components enabling long-haul optical fibre communications, inter-data centre optical interconnect and emerging 3D imaging and sensing technologies including eye-safe LiDAR chips. Leveraging the complementary growth techniques of molecular beam epitaxy (MBE) and metal organic chemical vapour deposition (MOCVD), we will incorporate manufacturable nanostructures as the gain medium to realise advanced devices surpassing state-of-the-art. Several routes will be explored to overcome the challenges in growing these materials and devices onto silicon towards fully integrated photonic platforms, opening up the opportunity for low cost and high volume mass production.
Organisations
Publications
Cao Z
(2022)
C- and L-band InAs/InP quantum dot lasers
Dear C
(2025)
The effect of rapid thermal annealing on 1.55 µm InAs/InP quantum dots
in Journal of Physics D: Applied Physics
Jia H
(2023)
Long-wavelength InAs/InAlGaAs quantum dot microdisk lasers on InP (001) substrate
in Applied Physics Letters
Liu S
(2024)
Effective InAsP dislocation filtering layers for InP heteroepitaxy on CMOS-standard (001) silicon
in Applied Physics Letters
Yan Z
(2024)
Recent progress in epitaxial growth of dislocation tolerant and dislocation free III-V lasers on silicon
in Journal of Physics D: Applied Physics
Yuan J
(2024)
Indium-flush technique for C-band InAs/InP quantum dots
in APL Materials
| Title | Supplementary Material |
| Description | Supplementary Material for Effective InAsP dislocation filtering layers for InP heteroepitaxy on CMOS-standard (001) silicon |
| Type Of Art | Image |
| Year Produced | 2024 |
| URL | https://aip.figshare.com/articles/figure/Supplementary_Material/26524390 |
| Description | 1. We have developed a novel dislocation filtering method for InP heteroepitaxy on standard (001) silicon substrates, demonstrating a reduction of threading dislocation density by two orders of magnitude. 2. We have developed low-threshold C-band InAs/InP quantum dot lasers grown by MOCVD. The fabricated ridge waveguide quantum dot lasers demonstrate a threshold current as low as 20 mA and lasing operation up to 120 °C under pulse current injection. 3. Combining MOCVD and MBE growth techniques at Cardiff University and University College London, we demonstrated InAs/InP quantum dot lasers on silicon substrates with a low threshold current density of 1.35 kA/cm2 and pulsed lasing up to 100 °C. |
| Exploitation Route | The quantum dot lasers developed in this project can be further improved as the semiconductor light sources for fibre-optic communications and eye-safe optical sensing applications. Thanks to their insensitivity of quantum dot lasers to crystal defects, these devices can be integrated onto the silicon photonics platform for future silicon based photonic integrated circuits. The InP buffer growth technique can be used for the integration of other dislocation tolerant lasers including quantum cascade lasers at mid-wave infrared wavelengths. |
| Sectors | Aerospace Defence and Marine Digital/Communication/Information Technologies (including Software) Electronics Environment Healthcare Manufacturing including Industrial Biotechology |
| Description | Cardiff, CEA-Leti and UCL collaboration |
| Organisation | CEA-Leti |
| Country | France |
| Sector | Charity/Non Profit |
| PI Contribution | MOCVD growth of novel dislocation filters for InP epitaxy on Si at Cardiff University. Contributions also include various materials characterisation and quantum dot laser structure integration. |
| Collaborator Contribution | The partner provided the InP/GaAs and InP/GaAs/Ge buffer templates grown on 300mm (001) silicon substrates using the MOCVD tool at CEA-Leti. |
| Impact | This collaboration has resulted in a joint publication in Applied Physics Letters in 2024. |
| Start Year | 2024 |
