Kissing bonds in adhesive joints: a holistic approach for nonlinear ultrasonic detection, joint mechanics and surface chemistry
Lead Research Organisation:
Queen Mary University of London
Department Name: Materials
Abstract
A kissing bond is an adhesive bonding defect in which the adhesive and the substrate are in contact or coupled though a weak bond or thin layer. They are thought to arise from either contamination of the surfaces during manufacture or various forms of environmental attack. When adhesives are used for safety critical applications the current approach is to undertake extremely careful process control. None-the-less premature failure of adhesive joints still occurs and kissing bonds are the most likely cause. In addition to this, one of the limiting factors preventing the more widespread use of adhesive bonding is the lack of quantitative non-destructive testing procedures capable of detecting kissing bonds. However, despite this need, the physical nature of the kissing bonds and their failure mechanics are unknown. This lack of knowledge acts as a fundamental barrier to progress and inhibits the design of appropriate NDT procedures. This project aims to investigate the phenomena of kissing bonds in adhesive joints and redress this lack of current understanding. The project will take a holistic approach and obtain 1) a detailed understanding of the physical nature of kissing bonds; 2) an understanding of how kissing bonds lead to a mechanical failure and; 3) undertake an nvestigation into their detectablity using both current state-of-the-art methods (high frequency ultrasonics) and using nonlinear ltrasonics which is an exciting emerging technology.
Publications
C Jeenjitkaew
(2009)
A Holistic approach to kissing bonds in adhesive joints
Choothum Jeenjitkaew (Author)
(2009)
A Holistic Approach to Kissing Bonds in Adhesive Joints
Choothum Jeenjitkaew (Author)
(2008)
Kissing Bonds in Adhesive Joints: Experimental Investigations and Numerical Predictions
Jeenjitkaew C
(2010)
Morphology and surface chemistry of kissing bonds in adhesive joints produced by surface contamination
in International Journal of Adhesion and Adhesives
Jeenjitkaew C
(2011)
Morphology and Surface Chemistry of Kissing Bonds in Adhesive Joints Produced by Using ElectRelease™ Adhesive
in The Journal of Adhesion
Description | Reliable and repeatable kissing bonds can be successfully produced using a mould release agent, Frekote, or weakening an electricallly debonding adhesive, ElectRelease(TM) with a low voltage. The surface chemistry and joint mechanics of the wekened interfaces can be analysed using a range of techniques. The strength of the weakened joints can be accurately predicted using numerical techniques (finite element analysis). |
Exploitation Route | ElectRelease(TM) adhesive has potential important uses in electronic manufacturing when adhesion is required during one stage of assembly. The chemistry and morpholgy associated with this debonding have been elucidated. This should lead to more confident use of this adhesive in such applications. The detection of kissing bonds from surface strain measurements has been shown to be a future viable approach. This is an important finding for manufacturers of structural bonded parts, including the aerospace and marine sectors. |
Sectors | Aerospace/ Defence and Marine,Electronics |
Description | AIRBUS OPERATIONS LIMITED |
Organisation | Airbus Group |
Country | France |
Sector | Academic/University |
Start Year | 2006 |
Description | QinetiQ |
Organisation | Qinetiq |
Country | United Kingdom |
Sector | Private |
Start Year | 2006 |
Description | Invited lecture for the Joint Branch of the RINA and IMarEst, Singapore |
Form Of Engagement Activity | A talk or presentation |
Part Of Official Scheme? | No |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | Interesting questions and discussions Lead to further invitation in UK |
Year(s) Of Engagement Activity | 2010 |
Description | Invited lecture to IMarEst, Liverpool IK |
Form Of Engagement Activity | A talk or presentation |
Part Of Official Scheme? | No |
Geographic Reach | Regional |
Primary Audience | Professional Practitioners |
Results and Impact | Interesting questions and discussions Adhesives had not been considered previously |
Year(s) Of Engagement Activity | 2011 |