Triple wavelength superspectral camera focal-plane array (SUPERCAMERA)
Lead Research Organisation:
University of Glasgow
Department Name: School of Engineering
Abstract
Optical imaging is perhaps the single most important sensor modality in use today. Its use is widespread in consumer, medical, commercial and defence technologies. The most striking development of the last 20 years has been the emergence of digital imaging using complementary metal oxide semiconductor (CMOS) technology. Because CMOS is scalable, camera technology has benefited from Moore's law reduction in transistor size so that it is now possible to buy cameras with more than 10 MegaPixels for £50. The same benefits are beginning to emerge in other imaging markets - most notably in infrared imaging where 64x64 pixel thermal cameras can be bought for under £1000. Far infrared (FIR), or terahertz, imaging is now emerging as a vital modality with application to biomedical and security imaging, but early imaging arrays are still only few pixel research ideas and prototypes that we are currently investigating.
There has been no attempt to integrate the three different wavelength sensors coaxially on to the same chip. Sensor fusion is already widespread whereby image data from traditional visible and mid infrared (MIR) sensors is overlaid to provide a more revealing and data rich visualisation. Image fusion permits discrepancies to be identified and comparative processing to be performed. Our aim is to create a "superspectral" imaging chip. By superspectral we mean detection in widely different bands, as opposed to the discrimination of many wavelengths inside a band - e.g. red, green and blue in the visible band. We will use "More than Moore" microelectronic technology as a platform. By doing so, we will leverage widely available low-cost CMOS to build new and economically significant technologies that can be developed and exploited in the UK. There are considerable challenges to be overcome to make such technology possible. We will hybridise two semiconductor systems to integrate efficient photodiode sensors for visible and MIR detection. We will integrate bolometric sensing for FIR imaging. We will use design and packaging technologies for thermal isolation and to optimise the performance of each sensor type. We will use hybridised metamaterial and surface plasmon resonance technologies to optimise wavelength discrimination allowing vertical stacking of physically large (i.e. FIR) sensors with visible and MIR sensors.
We ultimate want to demonstrate the world's first ever super-spectral camera.
There has been no attempt to integrate the three different wavelength sensors coaxially on to the same chip. Sensor fusion is already widespread whereby image data from traditional visible and mid infrared (MIR) sensors is overlaid to provide a more revealing and data rich visualisation. Image fusion permits discrepancies to be identified and comparative processing to be performed. Our aim is to create a "superspectral" imaging chip. By superspectral we mean detection in widely different bands, as opposed to the discrimination of many wavelengths inside a band - e.g. red, green and blue in the visible band. We will use "More than Moore" microelectronic technology as a platform. By doing so, we will leverage widely available low-cost CMOS to build new and economically significant technologies that can be developed and exploited in the UK. There are considerable challenges to be overcome to make such technology possible. We will hybridise two semiconductor systems to integrate efficient photodiode sensors for visible and MIR detection. We will integrate bolometric sensing for FIR imaging. We will use design and packaging technologies for thermal isolation and to optimise the performance of each sensor type. We will use hybridised metamaterial and surface plasmon resonance technologies to optimise wavelength discrimination allowing vertical stacking of physically large (i.e. FIR) sensors with visible and MIR sensors.
We ultimate want to demonstrate the world's first ever super-spectral camera.
Planned Impact
We will achieve both academic and KT impact from this project. All the investigators and their teams have an excellent track record in engagement with academic peers and in writing high quality papers that are published in leading journals. Similarly, the team members frequently attend and participate in the organisation of international conferences, ensuring rapid dissemination of work to the peer community.
We have industrial support in this project from 5 UK companies with a strong interest in imaging and sensor technologies, manufacturing technology and in electronics design and implementation. Gas Sensing Solutions (GSS) Ltd are a leading supplier of IR sensors. GSS will support the project experimentally and in an advisory capacity to a value of £140.8k. Selex are a world-leading supplier of electro-optic technologies. They have historically devoted much of their effort to the defence sector, but are now seeking new commercial opportunities. Selex are already funding research for future commercial sensor technologies in Glasgow, illustrating their belief in the knowledge transfer and research capabilities of the University. Plessey has extensive IP for the defence and security market and have entered into strategic alliance with Glasgow University. Their commitment to building on that relationship via this project is the provision to legacy CMOS foundry (0.35 micron) technology as required. The technology is ideal for our prototyping activity, and we may well pave the way for rapid IP transfer in the future. Plessey will support the project experimentally and in kind to a value of £100k. STMIcroelectronics in Edinburgh were the originator of the CMOS focal plane array and have a legacy of pioneering technology for image sensing. They are primarily interested in visible and IR imaging, but want to fully engage with the vision of the project. STMicroelectronics will also provide CASE support to a parallel funded DTA studentship that we will incorporate into the project. In total STMicroelectrics will support the project to a value of £90k. Logitech are the world-leader in wafer thinning and polishing for the semiconductors. Based near Glasgow they will provide their expertise in wafer thinning to a value of £165k enabling integration and packaging.
We do not anticipate that any one of these companies would want to commercialise the technology as a product by themselves. We therefore want to develop our own commercial spin-out opportunity. The companies we are working with will therefore operate as service providers and serve several functions in the overall product value chain. We will work with, e.g. EPSRC, TSB, Scottish Enterprise and GU's business development team in the follow-on stages of the project. This approach is appropriate since the funders aligned to economic development (e.e. TSB and SE) have identified nanotechnologies, electronic, photonic and sensor technologies as areas where the UK has the potential for new high growth business development.
We have industrial support in this project from 5 UK companies with a strong interest in imaging and sensor technologies, manufacturing technology and in electronics design and implementation. Gas Sensing Solutions (GSS) Ltd are a leading supplier of IR sensors. GSS will support the project experimentally and in an advisory capacity to a value of £140.8k. Selex are a world-leading supplier of electro-optic technologies. They have historically devoted much of their effort to the defence sector, but are now seeking new commercial opportunities. Selex are already funding research for future commercial sensor technologies in Glasgow, illustrating their belief in the knowledge transfer and research capabilities of the University. Plessey has extensive IP for the defence and security market and have entered into strategic alliance with Glasgow University. Their commitment to building on that relationship via this project is the provision to legacy CMOS foundry (0.35 micron) technology as required. The technology is ideal for our prototyping activity, and we may well pave the way for rapid IP transfer in the future. Plessey will support the project experimentally and in kind to a value of £100k. STMIcroelectronics in Edinburgh were the originator of the CMOS focal plane array and have a legacy of pioneering technology for image sensing. They are primarily interested in visible and IR imaging, but want to fully engage with the vision of the project. STMicroelectronics will also provide CASE support to a parallel funded DTA studentship that we will incorporate into the project. In total STMicroelectrics will support the project to a value of £90k. Logitech are the world-leader in wafer thinning and polishing for the semiconductors. Based near Glasgow they will provide their expertise in wafer thinning to a value of £165k enabling integration and packaging.
We do not anticipate that any one of these companies would want to commercialise the technology as a product by themselves. We therefore want to develop our own commercial spin-out opportunity. The companies we are working with will therefore operate as service providers and serve several functions in the overall product value chain. We will work with, e.g. EPSRC, TSB, Scottish Enterprise and GU's business development team in the follow-on stages of the project. This approach is appropriate since the funders aligned to economic development (e.e. TSB and SE) have identified nanotechnologies, electronic, photonic and sensor technologies as areas where the UK has the potential for new high growth business development.
Organisations
- University of Glasgow (Lead Research Organisation)
- Lockheed Martin (United States) (Collaboration)
- Selex ES (Collaboration)
- Compound Semiconductor Technologies Global (Collaboration)
- Gas Sensing Solutions (Collaboration)
- Roper Technologies (United Kingdom) (Project Partner)
- Gas Sensing Solutions (United Kingdom) (Project Partner)
- Leonardo (United Kingdom) (Project Partner)
- General Electric (United Kingdom) (Project Partner)
- STMicroelectronics (R&D) Ltd. (Project Partner)
Publications
Kenney M
(2019)
Large area metasurface lenses in the NIR region
Kenney M
(2019)
Alignment-insensitive bilayer THz metasurface absorbers exceeding 100% bandwidth.
in Optics express
Xie C
(2018)
Monolithically Integrated InAsSb-Based nBnBn Heterostructure on GaAs for Infrared Detection
in IEEE Journal of Selected Topics in Quantum Electronics
Humphreys M
(2018)
Video-rate terahertz digital holographic imaging system.
in Optics express
Grant J
(2018)
CMOS compatible metamaterial absorbers for hyperspectral medium wave infrared imaging and sensing applications.
in Optics express
Cumming, D
(2017)
Fractal Metasurface Absorbers with Octave-spannning
Kenney M
(2017)
Octave-Spanning Broadband Absorption of Terahertz Light Using Metasurface Fractal-Cross Absorbers
in ACS Photonics
Escorcia Carranza I
(2017)
Terahertz Metamaterial Absorbers Implemented in CMOS Technology for Imaging Applications: Scaling to Large Format Focal Plane Arrays
in IEEE Journal of Selected Topics in Quantum Electronics
Description | New THz and MIR imager technology New methods of integration using nano photonics |
Exploitation Route | New focal plane arrays for imaging. The project successfully demonstrated all the key basic technologies which are now being explored through other routes such as the EPSRC Hub for Quantum Enhanced Imaging. We are also carrying out a related project for CEOI with industrial support from Gooch and Housego and Leonardo. |
Sectors | Aerospace Defence and Marine Agriculture Food and Drink Electronics |
Description | The programme was delayed through the pandemic. Emerging from the pandemic we successfully bid for a Levelling-Up Impact Accelerator project through the Glasgow City Region. We are working with Thales, a major defence prime with a site in Glasgow and KNT which is a University of Glasgow owned nanotechnology company. Subcontracts are also being placed with two other Glasgow-based companies, III-V Epi and Wideblue. Together we are working on advanced MIR imaging technologies and a demonstrator MIR camera. Presently we are mid-way through this 2-year project. Outcomes are expected in 2025. |
Sector | Aerospace, Defence and Marine,Electronics,Environment |
Impact Types | Economic |
Title | CMOS Compatible Metamaterial Absorbers for Hyperspectral MWIR Imaging and Sensing Applications |
Description | This dataset includes simulation data, experimental data, images of the fabricated structures and all the data used to make the figures in both the main article and supplementary information. Access to the file 'Lumerical_FDTD_Simulations.zip' (9GB) can be requested by clicking the 'Request Data' button above. |
Type Of Material | Database/Collection of data |
Year Produced | 2018 |
Provided To Others? | Yes |
Title | Multi-Spectral materials: hybridisation of optical plasmonic filters, a mid infrared metamaterial absorber and a terahertz metamaterial absorber |
Description | |
Type Of Material | Database/Collection of data |
Year Produced | 2016 |
Provided To Others? | Yes |
Title | Octave-Spanning Broadband Absorption of Terahertz Light using Metasurface Fractal-Cross Absorbers |
Description | |
Type Of Material | Database/Collection of data |
Year Produced | 2017 |
Provided To Others? | Yes |
Title | Terahertz Metamaterial Absorbers implemented in CMOS Technology for Imaging Applications: Scaling to 64x64 Focal Plane Array Formats |
Description | |
Type Of Material | Database/Collection of data |
Year Produced | 2016 |
Provided To Others? | Yes |
Title | Terahertz imagers based on metamaterial structures monolithically integrated in standard CMOS technologies |
Description | Data underpinning the associated publication. |
Type Of Material | Database/Collection of data |
Year Produced | 2018 |
Provided To Others? | Yes |
Title | Uncooled CMOS terahertz imager using a metamaterial absorber and pn diode |
Description | |
Type Of Material | Database/Collection of data |
Year Produced | 2016 |
Provided To Others? | Yes |
Title | Video-rate Terahertz digital holographic imaging system |
Description | |
Type Of Material | Database/Collection of data |
Year Produced | 2018 |
Provided To Others? | Yes |
Description | CSTG |
Organisation | Compound Semiconductor Technologies Global |
Country | United Kingdom |
Sector | Private |
PI Contribution | We have completed the research into a novel III-V imaging technology and are now in discussion with CSTG about conversion to a manufacturable technology. |
Collaborator Contribution | CST is helping to prepare an application to InnovateUK |
Impact | We have completed an NDA and targeting upcoming InnovateUK deadlines. |
Start Year | 2017 |
Description | Gas Sensing Solutions |
Organisation | Gas Sensing Solutions |
Country | United Kingdom |
Sector | Private |
PI Contribution | growth of novel semiconductor layers |
Collaborator Contribution | Assistance with layer design and characterisation |
Impact | We are developing an InnovateUK proposal based on the work we have done on novel III-V imaging arrays |
Start Year | 2013 |
Description | Leonardo (Imaging) |
Organisation | Selex ES |
Department | SELEX Sensors and Airborne Systems |
Country | United Kingdom |
Sector | Private |
PI Contribution | Design of novel image sensor technology in the THz, MIR and visible bands |
Collaborator Contribution | Regular meetings and invitations to give talks in the company |
Impact | We are in discussion about new funding opportunities for commercialisation of research via the Quantum Imaging Hub |
Start Year | 2013 |
Description | Lockheed Martin |
Organisation | Lockheed Martin |
Country | United States |
Sector | Private |
PI Contribution | Evaluation of THz technology for use in agricultural markets |
Collaborator Contribution | Financial and project management support for project. Access to data on quadcopter technology. Site visits. Report writing. |
Impact | Ongoing collaboration and discussion about technologies at GU |
Start Year | 2016 |
Title | METHOD OF FABRICATING A MONOLITHIC SENSOR DEVICE FROM A LAYERED STRUCTURE |
Description | A method of fabricating a field-effect transistor in which a native oxide layer is removed prior to etching a gate recess. The cleaning step ensures that the etch of the gate recess starts at the same time across an entire sample, such that a uniform gate recess depth and profile can be achieved across an array of field-effect transistors. This results in a highly uniform switch-off voltage for the field-effect transistors in the array. |
IP Reference | WO2018224403 |
Protection | Patent application published |
Year Protection Granted | 2018 |
Licensed | No |
Impact | Stimulated research with industry that is still underway. New funding is being sought. |
Title | TERAHERTZ RADIATION DETECTOR, FOCAL PLANE ARRAY INCORPORATING TERAHERTZ DETECTOR, MULTISPECTRAL METAMATERIAL ABSORBER, AND COMBINED OPTICAL FILTER AND TERAHERTZ ABSORBER |
Description | The invention provides a detector comprising a metamaterial absorber and a micro-bolometer arranged to detect terahertz (THz) radiation. The metamaterial absorber can absorb multiple frequency bands, from the infrared and the THz regions of the electromagnetic spectrum. The detector is scalable to be suitable for use in a focal plane array. The invention also provides a hybrid of a plasmonic filter, e.g. for optical radiation, and a metamaterial absorber for terahertz (and/or infrared) radiation, to create a single material capable of absorbing narrow band terahertz radiation and filtering radiation in another part of the spectrum, e.g. optical radiation. Such material has great potential in future imaging technology where hybridisation can maximise the spectral information density of an optical system. |
IP Reference | US2015276489 |
Protection | Patent granted |
Year Protection Granted | 2015 |
Licensed | Commercial In Confidence |
Impact | Collaboration with industry on photonics technologies |
Description | National showcase event |
Form Of Engagement Activity | Participation in an activity, workshop or similar |
Part Of Official Scheme? | No |
Geographic Reach | National |
Primary Audience | Industry/Business |
Results and Impact | Demonstration and display stand at the annual Quantum Technologies showcase event, Westminster. |
Year(s) Of Engagement Activity | 2018 |
URL | http://uknqt.epsrc.ac.uk/news-and-events/events/ |