FLEXIBLE ELECTRONIC DEVICE MODELLING
Lead Research Organisation:
University of Glasgow
Department Name: School of Engineering
Abstract
Largely driven by material scientists, the flexible electronic research thus far has focussed on the materials and fabrication techniques. Whilst these are important areas, device modelling and circuit design is critical for taking the research closer to manufacturing. The acceptable degree of bendability for reliable operation of devices and circuits is a question that has not been addressed so far. This is a challenging because the standard transistor models for circuit simulation programs such as SPICE do not take into account the dynamic bendability induced effects. FLEXELDEMO will address these challenges by systematically characterizing the ultra-thin chips, identifying various parameters that change with bending, and suggesting improved BSIM models for devices over bendable substrates.
This project has several anticipated benefits over a range of time-scales. In the short-term, this project will substantially improve our understanding of changes in various device parameters as a result of bending (uni-axial, bi-axial or twisting etc.), which has traditionally been under-studied. In the medium-term, it will enable designing of electronics on bendable substrate and predicting the behaviour of bendable electronics just like we do currently for planar electronics. In the long-term, the project will lead to intelligent use of bendability in improving circuit design. For example, location or shape dependent strain-field variations will be used to design location-/shape-aware circuits or to compensate electronic artefacts (e.g. self-calibration). The approach could also lead to design on bendable electronics based on ensemble of nanowires.
Formulating the design rules and integration strategies through modelling will help in stabilizing the nascent flexible electronics technology. By adequately supporting the fabrication activities with modelling and simulation, this project will add significant new perspective to the fields of flexible electronics and electronics design.
This project has several anticipated benefits over a range of time-scales. In the short-term, this project will substantially improve our understanding of changes in various device parameters as a result of bending (uni-axial, bi-axial or twisting etc.), which has traditionally been under-studied. In the medium-term, it will enable designing of electronics on bendable substrate and predicting the behaviour of bendable electronics just like we do currently for planar electronics. In the long-term, the project will lead to intelligent use of bendability in improving circuit design. For example, location or shape dependent strain-field variations will be used to design location-/shape-aware circuits or to compensate electronic artefacts (e.g. self-calibration). The approach could also lead to design on bendable electronics based on ensemble of nanowires.
Formulating the design rules and integration strategies through modelling will help in stabilizing the nascent flexible electronics technology. By adequately supporting the fabrication activities with modelling and simulation, this project will add significant new perspective to the fields of flexible electronics and electronics design.
Planned Impact
Flexible electronic research thus far has focussed on the materials and fabrication techniques. Whilst these are important areas, device modelling and circuit design is critical for taking the research closer to manufacturing. The acceptable degree of bendability for reliable operation of devices and circuits is a question that has not been addressed so far. Such interactions have not been practically and scientifically investigated, due in part to the lack of suitable transistor models for circuit simulation programs such as SPICE. FLEXELDEMO will address these challenges by systematically characterizing the ultra-thin chips, identifying various parameters that change with bending, and suggesting improved BSIM models for devices over bendable substrates. . These investigations will also open up new areas of academic and industrial interest. For example, circuit designers will have to consider bending related changes in device response, which is challenging as existing computer aided design tools are not sufficient for such accommodating such inputs. This project has several anticipated benefits over a range of time-scales. In the short-term, this project will substantially improve our understanding of changes in various device parameters as a result of bending (uni-axial, bi-axial or twisting etc.), which has traditionally been under-studied. In the medium-term, it will enable designing of electronics on bendable substrate and predicting the behaviour of bendable electronics just like we do currently for planar electronics. In the long-term, the project will lead to intelligent use of bendability in improving circuit design. For example, location or shape dependent strain-field variations will be used to design location-/shape-aware circuits or to compensate electronic artefacts (e.g. self-calibration). The approach could also lead to design on bendable electronics based on ensemble of nanowires. Formulating the design rules and integration strategies through modelling will help in stabilizing the nascent flexible electronics technology. By adequately supporting the fabrication activities with modelling and simulation, this project will add significant new perspective to the fields of flexible electronics and electronics design.
People |
ORCID iD |
Ravinder Dahiya (Principal Investigator) |
Publications
Heidari H
(2015)
Towards bendable CMOS magnetic sensors
Yogeswaran N
(2015)
New materials and advances in making electronic skin for interactive robots
in Advanced Robotics
Khan S
(2015)
Si microwires based FETs on flexible substrates
Khan S
(2015)
Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review
in IEEE Sensors Journal
Khan S
(2015)
Flexible Pressure Sensors Based on Screen-Printed P(VDF-TrFE) and P(VDF-TrFE)/MWCNTs
in IEEE Transactions on Semiconductor Manufacturing
Khan S
(2015)
Flexible FETs using ultrathin Si microwires embedded in solution processed dielectric and metal layers
in Journal of Micromechanics and Microengineering
Khan S
(2015)
Flexible Tactile Sensors Using Screen-Printed P(VDF-TrFE) and MWCNT/PDMS Composites
in IEEE Sensors Journal
Dahiya R
(2015)
Electronic Skin
Description | The initial results from this project indicate that the output of electronics changes with bending of chips. This is because the mobility is dependent on the stress. |
Exploitation Route | I am collaborating with local company in the area of computer aided design of electronics. I aim to transfer the models developed from this project to this company and to others. |
Sectors | Digital/Communication/Information Technologies (including Software) Education Electronics |
Description | I have participated in knowledge exchange and public engagement activities. The research has led to more projects including with industry. Recently ARM has supported iCase phd studentship and currently there are discussions going on in terms of spin off. |
First Year Of Impact | 2016 |
Sector | Digital/Communication/Information Technologies (including Software),Electronics,Energy,Healthcare,Manufacturing, including Industrial Biotechology |
Impact Types | Economic |
Description | Global Challenge |
Amount | £39,000 (GBP) |
Organisation | Government of Scotland |
Department | Scottish Funding Council |
Sector | Public |
Country | United Kingdom |
Start | 02/2017 |
End | 06/2017 |
Description | Lord Kelvin Adam Smith Scholarship |
Amount | £150,000 (GBP) |
Organisation | University of Glasgow |
Sector | Academic/University |
Country | United Kingdom |
Start | 09/2015 |
End | 09/2019 |
Description | PhD Studentship |
Amount | £100,000 (GBP) |
Funding ID | EP/L016753/1 |
Organisation | Engineering and Physical Sciences Research Council (EPSRC) |
Sector | Public |
Country | United Kingdom |
Start | 04/2016 |
End | 04/2020 |
Description | Royal Society Grant |
Amount | £15,000 (GBP) |
Organisation | The Royal Society |
Sector | Charity/Non Profit |
Country | United Kingdom |
Start | 03/2014 |
End | 03/2015 |
Description | CPD Lecture at Scottish Schools Education Research Centre |
Form Of Engagement Activity | A talk or presentation |
Part Of Official Scheme? | No |
Geographic Reach | National |
Primary Audience | Schools |
Results and Impact | This CPD Lecture (on Electronic Touch) was organised by Scottish Schools Education Research Centre for teachers from Schools. The talk sparked discussion around more such lectures and teachers reported increased interest in organising such lectures in schools. Recently funding from Royal Academy of Engineering will allow me to achieve this. |
Year(s) Of Engagement Activity | 2014 |
URL | http://www.sserc.org.uk/index.php/cpd-roundup |
Description | CPD event at Scottish Schools Education Research Centre |
Form Of Engagement Activity | A talk or presentation |
Part Of Official Scheme? | No |
Geographic Reach | Regional |
Primary Audience | Schools |
Results and Impact | I was invited by Scottish Schools Education Research Centre for a CPD event for teachers from various Scottish Schools. The lecture during this CPD event initiated discussion on enriching STEM courses by including the subject area presented in my lecture. This event also led to plan for further engagements with schools (going to schools) and I also secured funding from Royal Academy of Engineering for this purpose. |
Year(s) Of Engagement Activity | 2015 |
URL | http://www.sserc.org.uk/index.php/cpd-roundup |
Description | Demonstration at Explorathon - European Researchers Night |
Form Of Engagement Activity | Participation in an activity, workshop or similar |
Part Of Official Scheme? | No |
Geographic Reach | Regional |
Primary Audience | Public/other audiences |
Results and Impact | Some of the research prototypes were demonstrated on this European researchers night day. |
Year(s) Of Engagement Activity | 2016 |
URL | http://www.explorathon.co.uk |
Description | Explorathon - European Researchers Night, Glasgow Science Centre |
Form Of Engagement Activity | Participation in an activity, workshop or similar |
Part Of Official Scheme? | No |
Geographic Reach | National |
Primary Audience | Public/other audiences |
Results and Impact | My team was selected to present our research at Exploration - European Researchers Night (funded by European Commission). More than 200 visitors (general public, kids, pupils from schools etc.) visited our booth and gained from the demos related to touch based prosthetics. |
Year(s) Of Engagement Activity | 2015 |
URL | http://www.explorathon.co.uk/glasgow |
Description | Global Leadership Board meeting of Weir Group |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Geographic Reach | International |
Primary Audience | Industry/Business |
Results and Impact | Research brief on Future felxible Electronics and electronic skin during Global Leadership Board meeting of Weir Group Plc |
Year(s) Of Engagement Activity | 2016 |
Description | Ingenious Public Engagement Award |
Form Of Engagement Activity | Participation in an activity, workshop or similar |
Part Of Official Scheme? | No |
Geographic Reach | National |
Primary Audience | Schools |
Results and Impact | The award funded by Royal Academy of Engineering supports 7 engineers (including myself) from my group who are visiting (this is an ongoing activity) 15 schools in Scotland to explain the working of various touch screen interfaces (including flexible/bendable interfaces) which we developed in lab through support from EPSRC impact acceleration account. After completion of school visits, the prototypes are to be placed in Glasgow Science Centre. |
Year(s) Of Engagement Activity | 2016 |
Description | Interview in BBC Radio 'NewsDrive' |
Form Of Engagement Activity | A press release, press conference or response to a media enquiry/interview |
Part Of Official Scheme? | No |
Geographic Reach | National |
Primary Audience | Public/other audiences |
Results and Impact | The key aspect of electronic skin research were shared with public through this interview. Also future plans were discussed. |
Year(s) Of Engagement Activity | 2016 |
Description | Invited to the 2016 Medical Devices Outward Mission to Taiwan by British Office in Taiwan |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Geographic Reach | International |
Primary Audience | Industry/Business |
Results and Impact | This business group (I also led the group on final day of the ) on biomedical sector involved 4 academic and industry members from UK who visited many Taiwanese institutes over 3 days. The group visited 2 universities, more than 10 companies and ITRI, a leading institute in Hsinchu Science park, which acts as a bridge between academia and industry in Taiwan. The visit was organised by Foreign and Commonwealth Office through its British Office's Science and Innovation network in Taiwan. The interaction (involving lecturers, one-to-one meetings, industry visits etc.) led to follow up discussions and potential collaborations are being discussed now. |
Year(s) Of Engagement Activity | 2016 |
URL | https://www.gov.uk/government/world/organisations/uk-science-and-innovation-network |
Description | National Science Museum's Antenna programme |
Form Of Engagement Activity | A broadcast e.g. TV/radio/film/podcast (other than news/press) |
Part Of Official Scheme? | No |
Geographic Reach | International |
Primary Audience | Public/other audiences |
Results and Impact | I was invited to participate in National Science Museum's commentary on their display related to tactile skin technology. This was part of Science Museum's Antenna programme |
Year(s) Of Engagement Activity | 2016 |
Description | New student club on 3D printed smart prosthetics |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Geographic Reach | Local |
Primary Audience | Undergraduate students |
Results and Impact | The club named 'Helping Hands' has brought together around 50 undergraduate and postgraduate students around the topic of 3D printed prosthetics (with touch enabled parts). The seed funding (£6K) for the club was obtained from Chancellors' fund through open competition. Following the formation of club I also received another £12K from EPSRC impact acceleration account to ensure sustainability and reach of this club. I am now working with NHS and a charitable trust (having presence in 31 countries) to provide students club a much wider reach. |
Year(s) Of Engagement Activity | 2015 |
URL | http://www.gla.ac.uk/about/givingtoglasgow/chancellorsfund/ |
Description | Question of Science - Quiz |
Form Of Engagement Activity | Participation in an activity, workshop or similar |
Part Of Official Scheme? | No |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | In recognition with my significant participation in the knowledge exchange activities, I was invited to join Glasgow University table at the Question of Science - annual Quiz competition organised by Glasgow Science Centre. Our team was the winner. About 30 teams (each with 8-10 members) participated in this event. |
Year(s) Of Engagement Activity | 2015 |
URL | http://www.glasgowsciencecentre.org/events-by-gsc/previous-events-a-question-of-science.html |
Description | TEDx Glasgow talk |
Form Of Engagement Activity | A talk or presentation |
Part Of Official Scheme? | No |
Geographic Reach | International |
Primary Audience | Public/other audiences |
Results and Impact | I was invited to speak at TEDx Glasgow. This was about tactile skin in robotics and prosthetics. I also presented key aspects of my grant. |
Year(s) Of Engagement Activity | 2016 |
URL | http://www.tedxglasgow.com |