Towards a 3D printed terahertz circuit technology.
Lead Research Organisation:
University of Birmingham
Department Name: Electronic, Electrical and Computer Eng
Abstract
Three-dimensional (3D) printing, also known as additive manufacturing, is now common place in many industries and is used widely. Some types of 3D printers are available for home use at modest cost. However, detailed work, together with demonstrator devices, is still in the very early stages in relation to the manufacture of microwave and terahertz circuits. These requires a level of precision and materials very different from the consumer products.
This proposal is to evaluate and improve the performance of 3D printing for microwave and terahertz passive and diode circuits through measurement, design and demonstration. These high frequencies, from 10 GHz to 1000 GHz, are used for free space communications, security sensing and remote monitoring of the Earth's atmosphere. The focus will be on evaluation of 3D printed circuits at frequencies above about 50 GHz, the small feature sizes required for these frequencies allows only the best printing process to compete; enabling the project to evaluate the most advanced 3D printing approaches. This exciting project will be the most comprehensive academic study worldwide to date.
A strong, experienced, national team, at the University of Birmingham and the STFC Rutherford Appleton Laboratory (RAL) will conduct the research in collaboration with several UK and international industry partners. The Communications and Sensing research group at Birmingham University have already demonstrated significant research in this area, with 3D printed devices published covering the frequency range 0.5 GHz to 100 GHz. The importance of this work has been recognised externally through prizes, invited international presentations and refereed academic publications. Birmingham's partners, the Millimetre Wave Technology Group in the RAL Space department, bring extensive expertise in precision manufacturing of conventional devices for these high frequencies, and knowledge of the demanding space and other requirements that the new 3D circuits must fulfil. RAL staff will conduct post processing of the 3D printed circuits and perform accelerated lifetime measurements under conditions of elevated temperature and humidity.
3D printed microwave and terahertz circuits will have an important beneficial economic impact on UK industry, not only because complex circuits become possible at low cost, but because new design approaches emerge because of the unique manufacturing. The applicants will both work on their own ideas, and closely with industrial partners, during the project. There are a number of hurdles to overcome before the technology becomes mainstream: this proposal tackles these challenges.
The advantages of 3D printing include the availability to rapidly generate novel circuits with complex shapes and multiple functions using low material volumes in a lightweight form. This enables reliable, low cost, superior performance circuits with less waste and reductions in lead time. Considerations to be addressed include the metal coating of polymer circuits which adds an extra step in the production, as well as potentially lower thermal stability and power handling of such circuits. If the polymer is used as a microwave dielectric, power loss may be a problem. For metal 3D printed circuits, power handling and thermal stability is good, but surface roughness may reduce device performance. These problems and others are addressed in the proposal with a methodical investigation based on the measurement of resonant waveguide cavities, the microwave equivalent of a tuning fork. Changes to the frequency and decay time indicate the quality of manufacture.
The project will inform industry and academia through a widely distributed technology development roadmap and external collaborative projects, as well as the provision of advice and guidance. Our finding will also be communicated to national and international colleagues through academic publications, and presentations at relevant conferences.
This proposal is to evaluate and improve the performance of 3D printing for microwave and terahertz passive and diode circuits through measurement, design and demonstration. These high frequencies, from 10 GHz to 1000 GHz, are used for free space communications, security sensing and remote monitoring of the Earth's atmosphere. The focus will be on evaluation of 3D printed circuits at frequencies above about 50 GHz, the small feature sizes required for these frequencies allows only the best printing process to compete; enabling the project to evaluate the most advanced 3D printing approaches. This exciting project will be the most comprehensive academic study worldwide to date.
A strong, experienced, national team, at the University of Birmingham and the STFC Rutherford Appleton Laboratory (RAL) will conduct the research in collaboration with several UK and international industry partners. The Communications and Sensing research group at Birmingham University have already demonstrated significant research in this area, with 3D printed devices published covering the frequency range 0.5 GHz to 100 GHz. The importance of this work has been recognised externally through prizes, invited international presentations and refereed academic publications. Birmingham's partners, the Millimetre Wave Technology Group in the RAL Space department, bring extensive expertise in precision manufacturing of conventional devices for these high frequencies, and knowledge of the demanding space and other requirements that the new 3D circuits must fulfil. RAL staff will conduct post processing of the 3D printed circuits and perform accelerated lifetime measurements under conditions of elevated temperature and humidity.
3D printed microwave and terahertz circuits will have an important beneficial economic impact on UK industry, not only because complex circuits become possible at low cost, but because new design approaches emerge because of the unique manufacturing. The applicants will both work on their own ideas, and closely with industrial partners, during the project. There are a number of hurdles to overcome before the technology becomes mainstream: this proposal tackles these challenges.
The advantages of 3D printing include the availability to rapidly generate novel circuits with complex shapes and multiple functions using low material volumes in a lightweight form. This enables reliable, low cost, superior performance circuits with less waste and reductions in lead time. Considerations to be addressed include the metal coating of polymer circuits which adds an extra step in the production, as well as potentially lower thermal stability and power handling of such circuits. If the polymer is used as a microwave dielectric, power loss may be a problem. For metal 3D printed circuits, power handling and thermal stability is good, but surface roughness may reduce device performance. These problems and others are addressed in the proposal with a methodical investigation based on the measurement of resonant waveguide cavities, the microwave equivalent of a tuning fork. Changes to the frequency and decay time indicate the quality of manufacture.
The project will inform industry and academia through a widely distributed technology development roadmap and external collaborative projects, as well as the provision of advice and guidance. Our finding will also be communicated to national and international colleagues through academic publications, and presentations at relevant conferences.
Planned Impact
This project will have a strong impact on a range of industrial sectors. Microwave devices are ubiquitous in all industries and whatever sector is chosen examples of the importance of them can be given. Birmingham have extensive capabilities in terahertz communications (via joint EPSRC work with RAL) and automotive radar for autonomous vehicles and RAL have world class expertise in the space industry.
This project is about moving 3D printed technology, as applied to microwave passive components, efficiently into industrial use. To do this the basic manufacturing is evaluated and improved and device design principles developed. Demonstrators are produced with specific industrial collaborators. The project will have TRL levels 1-4, with collaboration with industry moving to TRL 5 with specific successful designs.
The demonstrators with specific industrial collaborators are an important part of the project; here industry will provide specifications. The demonstrators include:
1. Complex beam forming networks for airborne and satellite environment with integrated feedhorns, polarisers and filters
2. A 220 GHz frequency tripler.
3. A satellite communications orthomode transducer
4. 5G communications from end demonstrator
5. D band multiplexer with polarisation control.
6. Integration of horns, polarisers, OMT and filters with twits and bends in waveguide
7. 300 GHz screen printed filters
With a range of new, novel designs produced in the course of the work, the expectation is that some will be patentable and more will be capable of commercial exploitation.
As well as collaboration with industry on each of the above demonstrators, there is also the Birmingham industrial steering group which will oversees the project. This has members from TeraTech Components, Elite Antennas, BAE Systems, Jaguar Land Rover, Thales and DSTL. In this way, there is a very large industrial oversight to this project.
In addition to the direct industrial oversight/collaboration mentioned above, there is also indirect dissemination to industry through web pages, conferences, seminars, publications and importantly a road map for 3D printed microwave circuits written within the project and disseminated widely.
It can be seen that the potential for new, novel circuits is considerable, such circuits will improve system performance in a number of industries. This programme of research aims to develop the technology and principles of 3D printing and importantly inform industry of the advantages and practical ways forward in using the new manufacturing technique. By disseminating the principles as well as example demonstrators we aim to provide a unique route to impact with rapid take up of 3D printing where it is appropriate. It should be noted although we have given examples above of industrial interest, the manufacturing will be of considerable interest in a variety of microwave areas we are unable to comprehend at this time.
This project is about moving 3D printed technology, as applied to microwave passive components, efficiently into industrial use. To do this the basic manufacturing is evaluated and improved and device design principles developed. Demonstrators are produced with specific industrial collaborators. The project will have TRL levels 1-4, with collaboration with industry moving to TRL 5 with specific successful designs.
The demonstrators with specific industrial collaborators are an important part of the project; here industry will provide specifications. The demonstrators include:
1. Complex beam forming networks for airborne and satellite environment with integrated feedhorns, polarisers and filters
2. A 220 GHz frequency tripler.
3. A satellite communications orthomode transducer
4. 5G communications from end demonstrator
5. D band multiplexer with polarisation control.
6. Integration of horns, polarisers, OMT and filters with twits and bends in waveguide
7. 300 GHz screen printed filters
With a range of new, novel designs produced in the course of the work, the expectation is that some will be patentable and more will be capable of commercial exploitation.
As well as collaboration with industry on each of the above demonstrators, there is also the Birmingham industrial steering group which will oversees the project. This has members from TeraTech Components, Elite Antennas, BAE Systems, Jaguar Land Rover, Thales and DSTL. In this way, there is a very large industrial oversight to this project.
In addition to the direct industrial oversight/collaboration mentioned above, there is also indirect dissemination to industry through web pages, conferences, seminars, publications and importantly a road map for 3D printed microwave circuits written within the project and disseminated widely.
It can be seen that the potential for new, novel circuits is considerable, such circuits will improve system performance in a number of industries. This programme of research aims to develop the technology and principles of 3D printing and importantly inform industry of the advantages and practical ways forward in using the new manufacturing technique. By disseminating the principles as well as example demonstrators we aim to provide a unique route to impact with rapid take up of 3D printing where it is appropriate. It should be noted although we have given examples above of industrial interest, the manufacturing will be of considerable interest in a variety of microwave areas we are unable to comprehend at this time.
Organisations
- University of Birmingham (Lead Research Organisation)
- Fraunhofer Society (Collaboration)
- Teratech Components (Collaboration)
- InnovaSec (Collaboration)
- RENA Technologies (Collaboration)
- 3D Microprint (Collaboration)
- Airbus Group (Collaboration)
- Southern University of Science and Technology (Collaboration)
- Elite Antennas (Collaboration)
- Huawei Technologies (Collaboration)
- Flann Microwave Ltd (Collaboration)
- Filtronic (Collaboration)
- Filtronic (United Kingdom) (Project Partner)
- Fraunhofer Institute for Manufacturing Technology and Advanced Materials (Project Partner)
- Elite Antennas (United Kingdom) (Project Partner)
- Tata Motors (United Kingdom) (Project Partner)
- Teratech Components (United Kingdom) (Project Partner)
- Airbus (United Kingdom) (Project Partner)
- 3D Micropring GmbH (Project Partner)
- InnovaSec Ltd (Project Partner)
- Huawei Technologies (Sweden) (Project Partner)
Publications
Chen X
(2021)
E -Plane Waveguide Filtering Six-Port Junction
in IEEE Transactions on Microwave Theory and Techniques
Chen X
(2021)
Ring-Shaped D -Band E -Plane Filtering Coupler
in IEEE Microwave and Wireless Components Letters
Chen X
(2022)
Subterahertz Filtering Six-Port Junction
in IEEE Transactions on Microwave Theory and Techniques
Gao Y
(2020)
Substrate Integrated Waveguide Filter-Amplifier Design Using Active Coupling Matrix Technique
in IEEE Transactions on Microwave Theory and Techniques
Gao Y
(2019)
An x-band waveguide orthomode transducer with integrated filters
in Microwave and Optical Technology Letters
Guo C
(2019)
A 3-D Printed $E$ -Plane Waveguide Magic-T Using Air-Filled Coax-to-Waveguide Transitions
in IEEE Transactions on Microwave Theory and Techniques
Guo C
(2021)
Monolithic 3D printed waveguide filters with wide spurious-free stopbands using dimpled spherical resonators
in IET Microwaves, Antennas & Propagation
Le H
(2022)
Laser precession machining of cross-shaped terahertz bandpass filters
in Optics and Lasers in Engineering
Lin J
(2024)
Single and Multiple-Band Bandpass Filters Using Bandstop Resonator Sections
in IEEE Journal of Microwaves
Mohammed A
(2022)
Conductivity measurement using 3D printed re-entrant cavity resonator
in Measurement Science and Technology
Mohammed A
(2021)
3D printed re-entrant cavity resonator for complex permittivity measurement of crude oils
in Sensors and Actuators A: Physical
Mohammed A
(2020)
3D printed coaxial microwave resonator sensor for dielectric measurements of liquid
in Microwave and Optical Technology Letters
Mostaani A
(2023)
Compact Self-Supportive Filters Suitable for Additive Manufacturing
in IEEE Transactions on Components, Packaging and Manufacturing Technology
Nie B
(2023)
A 3D-Printed Subterahertz Metallic Surface-Wave Luneburg Lens Multibeam Antenna
in IEEE Transactions on Terahertz Science and Technology
Qian L
(2023)
Compact Monolithic 3D-Printed Wideband Filters Using Pole-Generating Resonant Irises
in IEEE Journal of Microwaves
Salek M
(2019)
Compact $S$ -Band Coaxial Cavity Resonator Filter Fabricated By 3-D Printing
in IEEE Microwave and Wireless Components Letters
Salek M
(2020)
Two- GHz hybrid coaxial bandpass filter fabricated by stereolithography 3-D printing
in International Journal of RF and Microwave Computer-Aided Engineering
Salek M
(2019)
W-Band Waveguide Bandpass Filters Fabricated by Micro Laser Sintering
in IEEE Transactions on Circuits and Systems II: Express Briefs
Skaik T
(2022)
A 3-D Printed 300 GHz Waveguide Cavity Filter by Micro Laser Sintering
in IEEE Transactions on Terahertz Science and Technology
Skaik T
(2023)
Evaluation of 3-D Printed Monolithic G-Band Waveguide Components
in IEEE Transactions on Components, Packaging and Manufacturing Technology
Skaik T
(2022)
125 GHz Frequency Doubler Using a Waveguide Cavity Produced by Stereolithography
in IEEE Transactions on Terahertz Science and Technology
Sun L
(2023)
All-Metal Phased Array With Full Polarization Reconfigurability
in IEEE Transactions on Antennas and Propagation
Wang D
(2020)
WR -1.5 ( 500-750 GHz ) waveguide bandpass filter fabricated using high precision computer numerically controlled machining
in Microwave and Optical Technology Letters
You Y
(2021)
Millimeter-Wave 45° Linearly Polarized Corporate-Fed Slot Array Antenna With Low Profile and Reduced Complexity
in IEEE Transactions on Antennas and Propagation
Yu Y
(2022)
D -Band Waveguide Diplexer Fabricated Using Micro Laser Sintering
in IEEE Transactions on Components, Packaging and Manufacturing Technology
Yu Y
(2022)
State-of-the-Art: AI-Assisted Surrogate Modeling and Optimization for Microwave Filters
in IEEE Transactions on Microwave Theory and Techniques
Yu Y
(2020)
A General Coupling Matrix Synthesis Method for All-Resonator Diplexers and Multiplexers
in IEEE Transactions on Microwave Theory and Techniques
Yu Y
(2022)
Resonant Manifold Multiplexers
in IEEE Transactions on Microwave Theory and Techniques
Yu Y
(2022)
Automated Diplexer Design With Key Performance Indicator-Based Objectives
in IEEE Microwave and Wireless Components Letters
Zhang F
(2019)
3-D Printed Slotted Spherical Resonator Bandpass Filters With Spurious Suppression
in IEEE Access
Zhang F
(2020)
A 3-D Printed Bandpass Filter Using TM211-Mode Slotted Spherical Resonators With Enhanced Spurious Suppression
in IEEE Access
Zhao H
(2021)
E-Band Full Corporate-Feed 32 × 32 Slot Array Antenna With Simplified Assembly
in IEEE Antennas and Wireless Propagation Letters
Description | The research work has tested and pushed the boundary of the utilisation of additive manufacturing technologies in waveguide devices in terms of the operation frequency and allowable geometry. The capability of a number of different 3D printing techniques have been demonstrated using a large number of prototype devices. The research has identified key advantages as well as main limiting factors of additive manufacturing technologies for mm-wave and terahertz devices. The research has established an end-to-end process from 3d printing, surface polishing to plating. |
Exploitation Route | *De-risk the technology and raise the TRL; *Demonstrate capability; *Help us to compete for funding from ESA, UKSA and space industry *Equip industry to compete for commercial contract |
Sectors | Aerospace Defence and Marine Digital/Communication/Information Technologies (including Software) Electronics Manufacturing including Industrial Biotechology Transport |
Description | We have seen significantly increasing interests and take-ups from the industry sectors (microwave and space related) as well as from academia in this new manufacturing technology. In particular, we have seen more funding opportunities coming up from space sectors. The adoption of the technology in space is imminent. One particular device technology developed in this grant has been used by UK industry to compete for international commercial contracts. |
First Year Of Impact | 2021 |
Sector | Aerospace, Defence and Marine,Digital/Communication/Information Technologies (including Software),Electronics,Manufacturing, including Industrial Biotechology,Transport |
Impact Types | Economic |
Description | 4000131423/20/NL/FE Next Generation Temperature Compensated High Power Filters Based on Novel Materials |
Amount | € 599,042 (EUR) |
Funding ID | 4000131423/20/NL/FE |
Organisation | European Space Agency |
Sector | Public |
Country | France |
Start | 08/2020 |
End | 05/2023 |
Description | A Dual-Laser Additive Manufacturing System for Novel Materials (Green3D) |
Amount | £488,300 (GBP) |
Funding ID | EP/X041190/1 |
Organisation | Engineering and Physical Sciences Research Council (EPSRC) |
Sector | Public |
Country | United Kingdom |
Start | 09/2023 |
End | 09/2025 |
Description | ARTES 4.0 CORE COMPETITIVENESS GENERIC PROGRAMME LINE - Component A: ADVANCED TECHNOLOGY |
Amount | € 721,906 (EUR) |
Funding ID | 4000141943/23/NL/AF |
Organisation | European Space Agency |
Sector | Public |
Country | France |
Start | 12/2023 |
End | 12/2025 |
Description | EPSRC IAA: Equip UK microwave industry with end-to-end process capability leveraging additive manufacturing technology |
Amount | £49,000 (GBP) |
Organisation | Engineering and Physical Sciences Research Council (EPSRC) |
Sector | Public |
Country | United Kingdom |
Start | 06/2023 |
End | 06/2024 |
Description | Filters and multiplexers for mm-wave sounders and imagers |
Amount | € 399,998 (EUR) |
Funding ID | 4000140274/23/NL/MGu |
Organisation | European Space Agency |
Sector | Public |
Country | France |
Start | 03/2023 |
End | 12/2024 |
Description | HORIZON-MSCA-2022-PF-01 |
Amount | € 220,908 (EUR) |
Funding ID | 101109610 |
Organisation | European Commission |
Sector | Public |
Country | European Union (EU) |
Start |
Description | Open Space Innovation Platform (OSIP) |
Amount | £51,772 (GBP) |
Funding ID | 4000136425/21/NL/GLC/my |
Organisation | European Space Agency |
Sector | Public |
Country | France |
Start | 08/2021 |
End | 09/2025 |
Description | TALENT: Technician Led Equipment Fund |
Amount | £5,580 (GBP) |
Organisation | United Kingdom Research and Innovation |
Department | Research England |
Sector | Public |
Country | United Kingdom |
Start | 11/2020 |
End | 02/2021 |
Description | 3D Microprint GmbH |
Organisation | 3D Microprint |
Country | Germany |
Sector | Private |
PI Contribution | Our group contributes in designing of microwave components to be manufactured using 3D printing technology. |
Collaborator Contribution | Our partner 3DMicroPrint GmbH mainly contributes in manufacturing of devices using the state-of-the-art 3D printing machines with high precision and accuracy. |
Impact | Many devices have been designed, fabricated and tested. |
Start Year | 2016 |
Description | Airbus Defence and Space |
Organisation | Airbus Group |
Department | Airbus Defence and Space UK |
Country | United Kingdom |
Sector | Private |
PI Contribution | Our group will contribute with expertise in microwave engineering to develop waveguide components for satellite communication system. |
Collaborator Contribution | Airbus Defence and Space are interested in passive components for constellations of geostationary high throughput satellites. They will provide us with specification for devices. |
Impact | Work will commence soon. |
Start Year | 2018 |
Description | Collaboration with Flann Microwave Ltd |
Organisation | Flann Microwave Ltd |
Country | United Kingdom |
Sector | Private |
PI Contribution | We provide a potentially new manufacture solution to some of the company's products. |
Collaborator Contribution | The company provides the industry perspective in terms of applications and products of interest and some insightful design tips. |
Impact | Joint publication; Potentially a bid for the IAA scheme. |
Start Year | 2021 |
Description | Collaboration with RENA |
Organisation | RENA Technologies |
Country | Germany |
Sector | Private |
PI Contribution | Initiated a feasibility study |
Collaborator Contribution | Provided specialist process support. |
Impact | A conference publication is being prepared. |
Start Year | 2021 |
Description | Collaboration with SUSTEC, Shenzhen, China |
Organisation | Southern University of Science and Technology |
Country | China |
Sector | Academic/University |
PI Contribution | It is essentially an extension of this EPSRC grant. An improved synthesis method has been proposed and implemented. The technical supervision of the students are provided by myself, under a split-site PhD programme between UoB and SUSTEC. |
Collaborator Contribution | The partner provided scholarship to the students and some funding for research in terms of manufacturing. Some of the testing was also performed at the partner's site. |
Impact | Journal publications and two split-site PhD students. |
Start Year | 2018 |
Description | Elite Antennas Ltd |
Organisation | Elite Antennas |
Country | United Kingdom |
Sector | Private |
PI Contribution | Our group contributes with expertise in microwave engineering to design components such as orthomode transducers for satellite communications. |
Collaborator Contribution | Our partner provides us with specification for components used for Ka-band satellite communications. |
Impact | A novel orthomode transducer has been developed and tested. |
Start Year | 2017 |
Description | Filtronic |
Organisation | Filtronic |
Country | United Kingdom |
Sector | Private |
PI Contribution | Our group contributed with expertise in design of components specified by our partner Filtronic. |
Collaborator Contribution | Our partner Filtronic provided us with specification for a component used in communication systems. |
Impact | A component used in communications systems has been designed, fabricated and tested. |
Start Year | 2018 |
Description | Fraunhofer Institute |
Organisation | Fraunhofer Society |
Department | Fraunhofer Institute FKIE |
Country | Germany |
Sector | Academic/University |
PI Contribution | Our group contributes in designing microwave components to be manufactured using emerging technologies. |
Collaborator Contribution | Our partner contributes in manufacturing devices using emerging technologies such as 3D screen printing. |
Impact | A device at 300 GHz has been designed and fabricated using 3D screen printing technology. |
Start Year | 2016 |
Description | Huawei Group |
Organisation | Huawei Technologies |
Country | China |
Sector | Private |
PI Contribution | Our group will contribute with expertise in microwave engineering to design components for 5G communication system. |
Collaborator Contribution | Our partner will provide us with specification for components used in 5G communications systems. |
Impact | Work will commence soon. |
Start Year | 2018 |
Description | InnovaSec Ltd |
Organisation | InnovaSec |
Country | United Kingdom |
Sector | Private |
PI Contribution | collaboration to commence soon. |
Collaborator Contribution | collaboration to commence soon. |
Impact | collaboration to commence soon. |
Start Year | 2018 |
Description | Teratech Components Ltd |
Organisation | Teratech Components |
Sector | Private |
PI Contribution | Our group contributes with expertise in microwave components to design 3D printed frequency multipliers at frequencies above 100 GHz. |
Collaborator Contribution | Teratech Components Ltd manufacture and supply diodes operating at high frequencies to be used in multiplier circuit. |
Impact | A frequency multiplier operating above 100 GHz has been designed. |
Start Year | 2016 |
Description | Invited Workshop speaker in European Microwave Conference 2020 |
Form Of Engagement Activity | A talk or presentation |
Part Of Official Scheme? | No |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | 2020 EUMC - Workshop/Short Course name: "Recent Advances in Additive Manufacturing of Microwave Components" - Workshop Organiser: "Prof. Maurizio Bozzi (maurizio.bozzi@unipv.it)" - Workshop Co-Organiser: "Prof. Cristiano Tomassoni (cristiano.tomassoni@unipg.it)" - Paper Identifier: "W29-2" - Paper Title: "Microwave and millimetre-wave 3D printed waveguide filters" |
Year(s) Of Engagement Activity | 2020 |