ATLAS Upgrade construction proposal

Lead Research Organisation: University of Liverpool
Department Name: Physics

Abstract

The objective of this project is to construct elements of the ATLAS Phase-II Upgrade for operation at the High-Luminosity Large Hadron Collider (HL-LHC). The increased luminosity delivered, around a factor of 10 more than the will be delivered by 2023, by the HL-LHC to ATLAS will significantly enhance the physics programme. The Large dataset collected will allow ATLAS to make precision studies of the Higgs sector, the Standard Model of particle physics, and to extend the mass scales accessible to searches for signatures of new physics well into the TeV region. This will allow ATLAS to address many of the fundamental questions in particle physics:

Is the Higgs mechanism for generating fermion and weak gauge boson masses linked, as is implied by the Standard Model?

Does the Higgs mechanism limit the cross-section of vector boson scattering in the Standard Model at high energies, or is there new physics involved in electroweak symmetry breaking?

Why is the Higgs boson much lighter than the Planck Mass (the hierarchy problem)?

Is there a weakly interacting particle with mass of the order of the electroweak scale that could explain dark matter?

Is supersymmetry (SUSY), a symmetry between bosons and fermions, realised in nature?

Planned Impact

Please see file "Impact statement v2" in lead attachment

Publications

10 25 50
 
Description Design of planar pixel detectors for the ATLAS upgrade at the HL-LHC 
Organisation University of Glasgow
Country United Kingdom 
Sector Academic/University 
PI Contribution The design of pixel sensors for the High Luminosity upgrade of the ATLAS experiment. Designs of new pixel geometries, implants and guard ring structure for slim and active edge designs.
Collaborator Contribution Signing off the design and input for the design of test structures on the wafers
Impact CERN Pixel wafer designs 1-9
Start Year 2008
 
Description Development of flexible PCBs for pixel modules 
Organisation University of Milan
Country Italy 
Sector Academic/University 
PI Contribution Design of the hybrid PCB. Submission to PCB manufacturers and testing of manufactured parts
Collaborator Contribution Review of design process and submissions made to PCB manufacturers
Impact Designs submitted to multiple PCB manufacturers for production of parts
Start Year 2018
 
Description UK-US power boards for ATLAS upgrade strip barrel modules 
Organisation Brookhaven National Laboratory
Department Physics Department
Country United States 
Sector Public 
PI Contribution Research and development of small form factor powerboard
Collaborator Contribution Development of coils and future asic controller.
Impact This work enables the US to take this ASIC as a deliverable for the ATLAS upgrade project.
Start Year 2016
 
Description UK-US power boards for ATLAS upgrade strip barrel modules 
Organisation Lawrence Berkeley National Laboratory
Department Physics Division
Country United States 
Sector Public 
PI Contribution Research and development of small form factor powerboard
Collaborator Contribution Development of coils and future asic controller.
Impact This work enables the US to take this ASIC as a deliverable for the ATLAS upgrade project.
Start Year 2016
 
Description UK-US power boards for ATLAS upgrade strip barrel modules 
Organisation Penn State University
Department Department of Physics
Country United States 
Sector Academic/University 
PI Contribution Research and development of small form factor powerboard
Collaborator Contribution Development of coils and future asic controller.
Impact This work enables the US to take this ASIC as a deliverable for the ATLAS upgrade project.
Start Year 2016
 
Description UK-US power boards for ATLAS upgrade strip barrel modules 
Organisation Yale University
Department Department of Chemistry
Country United States 
Sector Academic/University 
PI Contribution Research and development of small form factor powerboard
Collaborator Contribution Development of coils and future asic controller.
Impact This work enables the US to take this ASIC as a deliverable for the ATLAS upgrade project.
Start Year 2016
 
Description development of a multiple hybrid panel crate based DAQ system 
Organisation Deutsches Electronen-Synchrotron (DESY)
Country Germany 
Sector Academic/University 
PI Contribution Development of hardware for testing of data transimissions, for data rates upto 640Mbit/s.
Collaborator Contribution Development of firmware for testing and analysis of data transimissions, for data rates upto 640Mbit/s.
Impact Results presented at ATLAS collaboration meetings.
Start Year 2016
 
Description development of a multiple hybrid panel crate based DAQ system 
Organisation Rutherford Appleton Laboratory
Country United Kingdom 
Sector Public 
PI Contribution Development of hardware for testing of data transimissions, for data rates upto 640Mbit/s.
Collaborator Contribution Development of firmware for testing and analysis of data transimissions, for data rates upto 640Mbit/s.
Impact Results presented at ATLAS collaboration meetings.
Start Year 2016
 
Description development of a multiple hybrid panel crate based DAQ system 
Organisation University of Toronto
Department Department of Physics
Country Canada 
Sector Academic/University 
PI Contribution Development of hardware for testing of data transimissions, for data rates upto 640Mbit/s.
Collaborator Contribution Development of firmware for testing and analysis of data transimissions, for data rates upto 640Mbit/s.
Impact Results presented at ATLAS collaboration meetings.
Start Year 2016
 
Description development of assembly tooling and method for strip hybrids 
Organisation Albert Ludwigs University of Freiburg
Department Department of Physics
Country Switzerland 
Sector Academic/University 
PI Contribution Development of design of assembly tooling and electrical circuit boards.
Collaborator Contribution Development of design of assembly tooling for alternative method.
Impact Final tools have been designed for the production strip barrel modules. Endcaps will follow the same concept. Tooling design has been shared with the international collaboration.
Start Year 2016
 
Title Design and submission of RD50-MPW2: a prototype chip with HV-CMOS sensors. 
Description Design and submission of RD50-MPW2. This is a prototype chip with HV-CMOS sensors. The chip size is 3212 um x 2120 um. It is in the 150 nm HV-CMOS process from LFoundry. 
Type Of Technology Detection Devices 
Year Produced 2019 
Impact RD50-MPW2 builds on ongoing research within the CERN-RD50 collaboration to develop depleted CMOS sensors in the 150 nm HV-CMOS process from LFoundry. Laboratory measurements of RD50-MPW1, the first prototype developed by the collaboration, show the leakage current generated by the sensors is large. These results suggest the submission of a second low-cost prototype prior to the planned, large and expensive demonstrator submission (RD50-ENGRUN1) is necessary. RD50-MPW2 integrates several test structures, one small matrix of pixels with analog readout electronics and a Single Event Upset (SEU) tolerant memory array that incorporate several solutions to optimise the leakage current. These solutions have been studied with TCAD simulations prior to the submission of the chip. The foundry has provided support to help better understand their technology process and reviewed the developed solutions. 
 
Description AIDA2020 Topical workshop on Future of Tracking 
Form Of Engagement Activity Participation in an activity, workshop or similar
Part Of Official Scheme? No
Geographic Reach International
Primary Audience Other audiences
Results and Impact Numerous International experts from various aspects of trackers (sensors, mechanics, cooling ...) have been invited to give talks in a Workshop organised by AIDA2020. I am on the organising committee.
Year(s) Of Engagement Activity 2019
URL https://indico.cern.ch/event/781403/registrations/participants
 
Description Pixel DAQ Workshop 
Form Of Engagement Activity Participation in an activity, workshop or similar
Part Of Official Scheme? No
Geographic Reach International
Primary Audience Other audiences
Results and Impact I organised a workshop for various experts to discuss the DAQ systems that are being used to readout pixel detectors. The first day was more theoretical and the second day was practical in the lab.
Year(s) Of Engagement Activity 2017