Development of a semi-automated laser bonding system and the associated novel assembly method for power devices

"This is a PhD research project in electrical engineering.
The PhD project aims to develop a laser based bonding system with well controlled force application, vision and alignment capability for microsystem assembly applications, in particular power electronic devices for high temperature applications as well as other high temperature devices (MEMS and sensors). The research is a key part of a major ongoing EPSRC funded research project on development of novel assembly and interconnection methods for GaN high power transistors in collaboration with Glasgow University where the devices are being developed. One part of the project is in design and construction of a setup that allows better control and monitoring of the bonding process. The second area is experimental validation of some novel bonding processes being developed in the group and explore new applications for example sensor devices, some feasibility work is being conducted with a company. "