Detector development for future particle detectors with a focus on new technologies for the ATLAS experiment at the LHC

Lead Research Organisation: University of Manchester
Department Name: Physics and Astronomy

Abstract

The project addresses one of the current challenges in high energy physics experiments: precision detection in both space and time or 4D tracking. All experiments at the CERN Large Hadron Collider will undergo upgrades in their systems to cope with the increased beam luminosities in the second half of this decade. The increased number of events will allow a larger statistic, with a consequent better probability of discoveries of new phenomena. The larger number of events, however, will also imply a larger overlap and an increase in radiation damage of the full detector system, in particular in the region closer to the interaction point. The Manchester group has pioneered the development and exploitation of 3D silicon sensors, which are now installed in the ATLAS Insertable B-Layer (IBL) and are planned for the upgraded Layer0 in 2027. 3D sensors, fabricated using Micro-Electro-Mechanical System (MEMS) technology, are processed with p- and n- electrodes inside the silicon bulk. This geometry has shown to be particularly suited for radiation tolerance and fast signal response. An evolution of the 3D geometry with trench electrodes combined with a new generation of front-end electronics chips are being studied to provide the required precision in space and time (<10 microns and <10 picoseconds) together with the necessary radiation tolerance >2x1016 ncm-2 for possible upgrades beyond 2027. The main objectives of the project are:
- Precision tracking using traditional 3D silicon sensors bump-bonded to the Timepix3 readout electronics chip. The Timepix3 readout has a pixel size of 55x55 microns squared, a response of 2ns and Time of Arrival (ToA) functionality.
- Precision tracking using traditional 3D silicon sensors bump-bonded to the Timepix4 readout electronics chip. The Timepix4 readout has a pixel size of 55x55 microns squared, a response of 200ps and is becoming available for bump bonding.
- Precision tracking using 3D silicon with trench-electrodes and a dedicated readout electronics. 3D with trench electrodes have been fabricated and preliminary tests are very encouraging. Tests with single channel readout electronics have shown a response of ~6 ps

Publications

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Studentship Projects

Project Reference Relationship Related To Start End Student Name
ST/W507659/1 30/09/2021 29/09/2025
2659507 Studentship ST/W507659/1 31/08/2021 28/02/2025 Matthew Addison