Bias temperature instability and condition monitoring in SiC power MOSFETs (2018)
Attributed to:
Reliability, Condition Monitoring and Health Management Technologies for WBG Power Modules
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2018.06.045
Publication URI: http://dx.doi.org/10.1016/j.microrel.2018.06.045
Type: Journal Article/Review
Parent Publication: Microelectronics Reliability