Thermal characterization of direct wafer bonded Si-on-SiC (2022)

First Author: Field D
Attributed to:  Silicon Carbide Power Conversion for Telecommunications Satellite Applications funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1063/5.0080668

Publication URI: http://dx.doi.org/10.1063/5.0080668

Type: Journal Article/Review

Parent Publication: Applied Physics Letters

Issue: 11