Development of HV-CMOS sensor technology for future tracking applications
Lead Research Organisation:
University of Liverpool
Department Name: Physics
Abstract
Integrated technologies will be employed more and more beyond the extremely high performance tracking applications that target the region nearest to the interaction point in collider physics experiments. The UK holds a strong leadership in the development and construction of intermediate and large area silicon strip detectors, with expertise ranging from sensor development and integrated circuit design to the engineering of complete detector systems. Investment in future technologies is essential to maintain this leadership. HV-CMOS is a very strong candidate to become one of the main technologies for high precision particle detection, because of its potential wide commercial availability, its cost effectiveness and its expected layout flexibility. Our proposal focuses on demonstrating these advantages and would be an important step to develop the ability in the UK to design custom detectors. This would be a key element in developing UK leadership in the application of this technology.
Planned Impact
The proposal will help built UK leadership in a technology area that is likely to dominate high granularity particle detection technologies in the future.
Development and production costs for charged particle detectors are expected to come down with the use of the proposed technology.
STFC will benefit from the increased choice of technologies and expected cost reductions.
The low development cost the detector concept targeted in the proposal will open up new possibilities for the applications of particle detection technologies outside scientific research. Position sensitive particle detectors have a wide range of applications in areas including medicine, home-land security, container monitoring in ports and at borders, non-proliferation, etc.
Development and production costs for charged particle detectors are expected to come down with the use of the proposed technology.
STFC will benefit from the increased choice of technologies and expected cost reductions.
The low development cost the detector concept targeted in the proposal will open up new possibilities for the applications of particle detection technologies outside scientific research. Position sensitive particle detectors have a wide range of applications in areas including medicine, home-land security, container monitoring in ports and at borders, non-proliferation, etc.
Organisations
- University of Liverpool, United Kingdom (Lead Research Organisation)
- Brookhaven National Laboratory, United States (Collaboration)
- University of Bern (Collaboration)
- University of Tsukuba, Japan (Collaboration)
- IFIC Barcelona (Collaboration)
- Karlsruhe Institute of Technology (Collaboration)
- University of Geneva, Switzerland (Collaboration)
- University of Heidelberg, Germany (Collaboration)
Publications
Anders J
(2018)
Charge collection characterisation with the Transient Current Technique of the ams H35DEMO CMOS detector after proton irradiation
in Journal of Instrumentation
Arndt K
(2021)
Technical design of the phase I Mu3e experiment
in Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Benoit M
(2018)
Test beam measurement of ams H35 HV-CMOS capacitively coupled pixel sensor prototypes with high-resistivity substrate
in Journal of Instrumentation
Benoit M
(2016)
Results of the 2015 testbeam of a 180 nm AMS High-Voltage CMOS sensor prototype
in Journal of Instrumentation
Casanova Mohr R
(2018)
Design and characterization of the monolithic matrices of the H35DEMO chip
Franks M
(2021)
E-TCT characterization of a thinned, backside biased, irradiated HV-CMOS pixel test structure
in Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Kiehn M
(2019)
Performance of the ATLASPix1 pixel sensor prototype in ams aH18 CMOS technology for the ATLAS ITk upgrade
in Journal of Instrumentation
Peric I
(2017)
Status of HVCMOS developments for ATLAS
in Journal of Instrumentation
Schimassek R
(2021)
Test results of ATLASPIX3 - A reticle size HVCMOS pixel sensor designed for construction of multi chip modules
in Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
| Description | On this project we have produced prototype pixel sensors with both hybrid and fully monolithic pixel arrays in AMS 350nm High Voltage CMOS technology node, the AMS 180nm High Voltage CMOS technology node and the LFoundry 150nm High Voltage CMOS technology node. |
| Exploitation Route | HV-MAPS sensrs have already become the chosen technology for the Mu3e experiment at PSI and is a serious contender technology for ATLAS pixel sensors for the high luminosity LHC upgrade. In general we expected these sensoers to become one of the technologies of choise for future paticle tracking applications that need good position resolution, high speed readout and good radiation tolerance. There is now a wide international effort on this tecjhnology and our grant helped substantailly to allow the UK to contribute to this. Our efoorts continue through the development fo HV_MAPS sensors for Mu3e, ATLAS and other future experinments and, on a more generic level, thorugh the CERN RD50 collaboration. |
| Sectors | Aerospace, Defence and Marine,Agriculture, Food and Drink,Chemicals,Electronics,Environment,Healthcare,Pharmaceuticals and Medical Biotechnology,Security and Diplomacy |
| Description | The work funded under this grant has been the start of wider reserach activitiy which includes the further development of HV-CMOS technology with a parrticular focus on medical applications thr improved instrumentation for proton therapy applications. |
| First Year Of Impact | 2016 |
| Sector | Healthcare |
| Impact Types | Societal |
| Description | HV-CMOS collaboration |
| Organisation | Brookhaven National Laboratory |
| Country | United States |
| Sector | Public |
| PI Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Collaborator Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Impact | First prototype pixel sensors in AMS 350 nm HV-CMOS technology |
| Start Year | 2014 |
| Description | HV-CMOS collaboration |
| Organisation | Heidelberg University |
| Country | Germany |
| Sector | Academic/University |
| PI Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Collaborator Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Impact | First prototype pixel sensors in AMS 350 nm HV-CMOS technology |
| Start Year | 2014 |
| Description | HV-CMOS collaboration |
| Organisation | IFIC Barcelona |
| Country | Spain |
| Sector | Private |
| PI Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Collaborator Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Impact | First prototype pixel sensors in AMS 350 nm HV-CMOS technology |
| Start Year | 2014 |
| Description | HV-CMOS collaboration |
| Organisation | Karlsruhe Institute of Technology |
| Country | Germany |
| Sector | Academic/University |
| PI Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Collaborator Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Impact | First prototype pixel sensors in AMS 350 nm HV-CMOS technology |
| Start Year | 2014 |
| Description | HV-CMOS collaboration |
| Organisation | University of Bern |
| Department | Institute for Surgical Technology and Biomechanics |
| Country | Switzerland |
| Sector | Academic/University |
| PI Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Collaborator Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Impact | First prototype pixel sensors in AMS 350 nm HV-CMOS technology |
| Start Year | 2014 |
| Description | HV-CMOS collaboration |
| Organisation | University of Geneva |
| Department | Physics Section |
| Country | Switzerland |
| Sector | Academic/University |
| PI Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Collaborator Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Impact | First prototype pixel sensors in AMS 350 nm HV-CMOS technology |
| Start Year | 2014 |
| Description | HV-CMOS collaboration |
| Organisation | University of Tsukuba |
| Country | Japan |
| Sector | Academic/University |
| PI Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Collaborator Contribution | Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices |
| Impact | First prototype pixel sensors in AMS 350 nm HV-CMOS technology |
| Start Year | 2014 |
| Title | Engineering run submission to AMS in H18 CMOS process |
| Description | Co-design of submission including ATLAS pixel devices and MuPix8 Matrix. |
| Type Of Technology | Detection Devices |
| Year Produced | 2016 |
| Impact | Device not yet back from manufacturer. Evaluation still to come. |
| Title | H35DEMO: Engineering run submission to AMS in h35 process |
| Description | Prototype pixel sensors with both hybrid and fully monolithic pixel arrays in AMS 350nm High Voltage CMOS technology node |
| Type Of Technology | Detection Devices |
| Year Produced | 2015 |
| Impact | Testing of the novel devices and further development of the technology will take place in 2016. |
| Title | Lfoundry MPW submission in their 150 nm HV-CMOS process. |
| Description | Co-design of MPW submission including ATLAS and mu3e test devices |
| Type Of Technology | Detection Devices |
| Year Produced | 2016 |
| Impact | Evaluation is ongoing. |
| Title | Lfoundry MPW submission of small pixel prototype |
| Description | Prototype to demonstrate 50x50 micorn pixel matrix with high level of in-pixel electronics. |
| Type Of Technology | Detection Devices |
| Year Produced | 2016 |
| Impact | Device will be received back from manufacturer in early 2017. Evalulation still to come. |